Article 13316

Title of the article

EVALUATING THE RELIABILITY OF UNSOLDERED PRESSED
CONNECTION BY OHMIC RESISTANCE

Authors

Vasil'ev Fedor Vladimirovich, candidate of technical sciences, associate professor, sub-department of avionic technology, Moscow Aviation Institute (National Research University), (125993, 4 Volokolamskoe highway, Moscow, Russia), fedor@niit.ru
Vantsov Sergey Vasil'evich, candidate of technical sciences, associate professor, sub-department of avionic technology, Moscow Aviation Institute (National Research University),(125993, 4 Volokolamskoe highway, Moscow, Russia), vancov@medpractika.ru
Medvedev Arkadiy Maksimovich, doctor of technical science, professor, sub-department of avionic technology,President of Guild of Professional Electronics Technologist,Moscow Aviation Institute (National Research University), (125993, 4 Volokolamskoe highway, Moscow, Russia), medvedevam@bk.ru
Stepanova Mariya Aleksandrovna, postgraduate student, Moscow Aviation Institute (National Research University), (125993, 4 Volokolamskoe highway, Moscow, Russia), bammbuka@mail.ru
Khomutskaya Ol'ga Vladislavovna, postgraduate student, Moscow Aviation Institute (National Research University), (125993, 4 Volokolamskoe highway, Moscow, Russia), khomutskauaov@gmail.com

Index UDK

621.3.062

DOI

10.21685/2307-4205-2016-3-13

Abstract

Power electronic devices, particularly in avionics and naval systems, printed circuit boards are used with power circuits. Installation conclusions components soldering in such boards is difficult and in some cases even impossible due to the powerful heat sink on these circuits, which makes it difficult to warm up theconnection to soldering. To overcome this difficulty allows application solderless connections, operated by forging contact pins in metallized holes (solderless connection type Press-Fit). Today the connection Press-Fit are widely used in telecommunications and automotive electronics. The new direction of use of solderless compounds of this type was their use in electronic systems responsible destination. This makes the topical research on behavior of pressed joints in power electronics in extreme operating conditions and requires testing their reliability. Normally the connection resistance Press-Fit assess exceptions force the contact pin out of the hole. But because the connection type Press-Fit is also an electric element interconnections, it is more appropriate to assess their resistance to change electrical resistance before and after exposure to climatic and mechanical loads. During the test for reliability is carried out resistance measurement of coherent chain Press-Fit plating- printed Guide-pin hole plating. Received confirmation of viability of this approach to assessing physical security with respect to avionics systems.

Key words

solderless connections, forging connections Press-Fit, contact resistance, power circuits, avionic.

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Дата создания: 28.09.2016 15:21
Дата обновления: 29.09.2016 15:39